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February 22, 2024
VIEWPOINT 2024: Mohan Iyer, Vice President and General Manager of Semiconductor, Thermo Fisher Scientific
However, as chips, such as multi-die packaged solutions, become more complex, so too are design and manufacturing. This complexity is driving demand for more TEM metrology data, high volume sample preparation, and analytical solutions for devices with smaller dimensions, novel materials, and new power delivery networks. As the industry's leading provider of preparation, metrology, and failure analysis solutions, we’re acutely aware of the necessity for innovations that meet such demands, while also providing faster time-to-data and increased tool and talent productivity. Entering 2024, we're proud of the end-to-end workflows we continue to enhance to automate and streamline time intensive processes. We also look forward to building upon the technology in our suite of solutions that enable the industry to obtain critical data and identify defects faster. An example of this is the Thermo Scientific Hydra DualBeam. With this PFIB-SEM, we have incorporated four ion species, argon, nitrogen, oxygen and xenon, to support cleaner and faster milling through disparate materials found in multi-die packaged solutions. By using Ar for delayering, our customers are obtaining better quality samples approximately 40% faster. In this new year, we continue to look forward to collaborating with the semiconductor industry and contributing to its future success. Mohan Iyer, Vice President and General Manager of Semiconductor Thermo Fisher Scientific https://www.thermofisher.com/us/en/home.html |
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